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| STTH2006 Turbo 2 ultrafast high voltage rectifier Main product characteristics IF(AV) VRRM Tj VF (typ) trr (max) 20 A 600 V 175 C 1.0 V 50 ns A K Features and benefits DO-247 STTH2006W Ultrafast switching Low reverse current Low thermal resistance Reduces switching and conduction losses Description The STTH2006 uses ST Turbo 2 600 V technology and is especially suited for use in switching power supplies, and industrial applications, such as rectification and continuous mode PFC boost diode. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj Repetitive peak reverse voltage RMS forward voltage Average forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Order Codes Part Number STTH2006W Marking STTH2006W Absolute Ratings (limiting values) Parameter Value 600 50 Tc = 120 C = 0.5 20 160 -65 to + 175 175 Unit V A A A C C tp = 10 ms sinusoidal July 2006 Rev 1 1/7 www.st.com 7 Characteristics STTH2006 1 Characteristics Table 2. Symbol Rth(j-c) Junction to case Thermal resistance Parameter Value (max). 1.1 Unit C/W Table 3. Symbol IR (1) VF (2) s Static electrical characteristic Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25 C Tj = 150 C Tj = 25 C Tj = 150 C VR = VRRM Min. Typ Max. 25 A 80 800 1.75 IF = 20 A V 1.00 1.35 Unit 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 1.13 x IF(AV) + 0.011 IF2(RMS) Table 4. Symbol Dynamic characteristics Parameter Reverse recovery time Reverse recovery current Forward recovery time Forward recovery voltage Test conditions IF = 0.5 A Irr = 0.25 A IR =1 A Tj = 25 C IF = 1 A dIF/dt = -50 A/s VR =30 V 50 8 Min. Typ Max. Unit 50 ns 70 11 500 2.5 A ns V trr IRM tfr VFP VR = 400 V I = 30 A Tj = 125 C F dIF/dt = -100 A/s Tj = 25 C Tj = 25 C IF = 30 A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 30 A dIF/dt = 100 A/s VFR = 1.1 x VFmax 2/7 STTH2006 Characteristics Figure 1. P(W) 35 30 25 20 15 10 5 Conduction losses versus average forward current Figure 2. 200 Forward voltage drop versus forward current IFM(A) =0.05 =0.1 =0.2 =0.5 =1 180 160 140 120 100 80 60 T Tj=25 C (Maximum values) Tj=150 C (Typical values) Tj=150 C (Maximum values) 40 IF(AV)(A) 0 0 5 10 15 20 25 =tp/T tp 20 VFM(V) 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse IRM(A) 30 VR=400V Tj=125C IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 25 20 IF=0.25 x IF(AV) 15 10 5 tp(s) 0 0 50 100 150 200 dIF/dt(A/s) 250 300 350 400 450 500 Figure 5. trr(ns) 200 Reverse recovery time versus dIF/dt (typical values) Figure 6. Qrr(C) 3.0 Reverse recovery charges versus dIF/dt (typical values) VR=400V Tj=125C VR=400V Tj=125C 2.5 IF=2 x IF(AV) 150 IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 2.0 IF=IF(AV) 100 1.5 1.0 50 0.5 IF=0.5 x IF(AV) dIF/dt(A/s) 0 0 200 400 600 800 1000 0.0 0 200 dIF/dt(A/s) 400 600 800 1000 3/7 Characteristics STTH2006 Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=400V Reference: Tj=125C S factor S factor 0.6 IF2 x IF(AV) VR=400V Tj=125C 2.50 2.25 2.00 1.75 0.5 0.4 1.50 1.25 1.00 0.3 0.2 0.75 0.50 IRM 0.1 0.25 QRR dIF/dt(A/s) 0.0 0 50 100 150 200 250 300 350 400 450 500 Tj(C) 25 50 75 100 125 0.00 Figure 9. VFP(V) 8.0 7.5 7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) 800 700 600 500 400 300 200 100 IF=IF(AV) VFR=1.1 x VF max. Tj=125C IF=IF(AV) Tj=125C dIF/dt(A/s) 0 100 200 300 400 500 0 100 dIF/dt(A/s) 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 100 VR(V) 10 1 10 100 1000 4/7 STTH2006 Package information 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm DO-247 Package dimensions Dimensions Ref. Millimeters Min. A V Table 5. Inches Min. 0.191 0.086 0.015 0.039 0.078 Typ. Max. 0.203 0.102 0.031 0.055 Typ. Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 2.00 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55 D E Dia. V F F2 H A F3 G H 2.40 0.078 0.429 0.094 L5 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139 0.620 0.793 0.169 L L2 L4 F2 L3 F3 V2 F G M E L L1 L1 D L2 L3 L4 L5 M V V2 Dia. 0.582 0.118 0.143 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STTH2006 3 Ordering information Ordering type STTH2006W Marking STTH2006W Package DO-247 Weight 4.40 g Base qty 30 Delivery mode Tube 4 Revision history Date 13-Jul-2006 Revision 1 Initial release. Changes 6/7 STTH2006 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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